The wafer-level stacking (WLS) process uses advanced mask alignment equipment to stack multiple optical WLO wafers and rigid spacers with micron-level precision. The resulting assemblies are characterized by a barrel-free and bracket-free design, high compactness, high integration, and reflow compatibility.
Imaging Lenses
Imaging lens modules produced through wafer-level stacking and singulation enable compactness and high-precision for next-generation consumer and medical devices. By stacking multiple wafer layers with precisely aligned micro-optical structures, these optical lens modules deliver camera-grade imaging performance in ultra-thin, cost-efficient formats. With scalability for high-volume manufacturing, they support applications from smartphones, AR/VR headsets, AI glasses to automotive sensing and medical diagnostics.Projection Lenses
Projection lens modules manufactured with wafer-level stacking and singulation deliver ultra-compact and scalable optical solutions for structured light, dot projection, and pattern illumination. By integrating multiple micro-optical layers, these modules provide precise divergence control, high optical efficiency, and tailored beam shaping, all within a thin and robust package. With proven high-volume manufacturability, they power applications from 3D sensing and AR/VR/AI glass to automotive interior and exterior projection systems.
Heptagon Photonics Pte. Ltd.
7000 Ang Mo Kio Avenue 5, #06-02-03, Singapore (569877)
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